Quality Control
QA/QC Introduction
QC department
Test Equipment and Facilities
Name:Die Bonder
Description:Die Bonder is used to fix chip.
Description:Die Bonder is used to fix chip.
Name:High Frequency Equipment
Description:High Frequency Equipment is used for pressing and absorbing the blister
Description:High Frequency Equipment is used for pressing and absorbing the blister
Name:Integrating Sphere
Description:Integrating sphere is used to test brightness or degree of light-degradation.
Description:Integrating sphere is used to test brightness or degree of light-degradation.
Name:Light Color Splitting
Description:Light Color Splitting is used to classify the colors, MCD, Voltage of LED.
Description:Light Color Splitting is used to classify the colors, MCD, Voltage of LED.
Name:Spot UV Coating
Description:Spot UV Coating is used to fix product's structure .
Description:Spot UV Coating is used to fix product's structure .
Name:Wire Bonder
Description:Wire Bonder is used to connect the two polars of LED chips.
Description:Wire Bonder is used to connect the two polars of LED chips.
Name:PCB Board Engraving machine
Description:PCB Biard engraving machine is used to engrave PCB.
Description:PCB Biard engraving machine is used to engrave PCB.
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Company Info
Shenzhen Hipower Optoelectronic Co., Ltd.
[China (Mainland)]
[Verified Member]
City: Shenzhen
Province/State: Guangdong
Country/Region : China (Mainland)
Business Type:Manufacturer, Distributor/Wholesaler
Online Postings: Products